Micron bundles mobile DRAM and NAND flash

Barcelona (Spain) - Micron will begin offering memory solutions for cellphones that combine DRAM and NAND flash memory in one package.

The company introduced a new 78 nm, 1 Gb (128 MB) DRAM chip at the 3GSM Word Congress and confirmed that it will be offering the device also in combination with 1 Gb (128 MB), 2 Gb (256 MB) and 4 Gb (512 MB) NAND flash chips. The company claims that the multi-chip package (MCP) consumes less space than traditional, separate memory chips and opens the door for thinner cell phone designs.

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