ISSCC
Latest about ISSCC

Intel's Heracles chip computes fully-encrypted data without decrypting it
By Anton Shilov published
No decryption occurs inside the processor, eliminating entire classes of attacks.

ISSCC 2026: Rebellions details industry's first quad-chiplet AI solution with UCIe interconnects
By Anton Shilov published
Premium A sign of things to come.

ISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
By Luke James published
Premium Taking to the stage at ISSCC, AMD’s Ramasamy Adaikkalavan talked through how AMD managed to fit nearly double the compute throughput into the same die area as its predecessor,

Samsung unveils 10th Gen V-NAND: 400+ layers, 5.6 GT/s and hybrid bonding
By Anton Shilov published
Samsung's 10th Gen V-NAND uses 400+ layers, adopts Cell-on-Peripheral with hybrid bonding architecture.

Kioxia's 10th gen 3D NAND flash is up to 33% faster than 8th gen ICs
By Sayem Ahmed published
Kioxia's 10th generation 332-layer 3D NAND flash is up to 33% faster than prior-gen NAND, boasted the company at ISSCC 2025.

Researchers reveal chips that commit 'circuit suicide' — self-destruction and counterfeit protection in one
By Christopher Harper published
As part of several anti-hacking measures introduced at ISSCC this year, a University of Vermont team created a self-destructing fingerprinting mechanism for different circuits.

Samsung to demo higher-bandwidth GDDR7 VRAM next month at ISSCC
By Christopher Harper published
The International Solid-State Circuits Conference will be host to many major industry players, including Samsung and SK hynix showing off new versions of GDDR7.
AMD Puts Hopes on Packaging, Memory on Logic, Optical Comms for Decade Ahead
By Mark Tyson published
AMD's efforts have doubled performance every two years in some computing fields, and it plans to keep these trends on track with advanced architecture and packaging.
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