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PremiumAMD's Enterprise CPU and GPU roadmap: Venice, Verano, Zen 6, Helios, and CDNA
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PremiumGTC 2026: Ian Buck press Q&A transcript — VP of Hyperscale and HPC speaks out on shelving CPX and shipping LPU decode this year
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PremiumThe $599 MacBook Neo stunned the budget laptop market
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Premium Features
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PremiumGTC 2026: Ian Buck press Q&A transcript — VP of Hyperscale and HPC speaks out on shelving CPX and shipping LPU decode this year
By Luke James Published -
PremiumThe $599 MacBook Neo stunned the budget laptop market
By Andrew E. Freedman Published -
PremiumHow to protect yourself from bad external SSDs during the PC hardware apocalypse
By Matt Safford Published -
PremiumShortages of crucial chip packaging material threatens AI accelerator supply chains
By Chris Stokel-Walker Published -
PremiumMotherboard buying advice for the PC building apocalypse
By Joe Shields Published -
PremiumExploring the future of Artificial Intelligence — today's models, tomorrow's agents, and the big privacy problem
By Bruno Ferreira Published
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Roadmaps
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PremiumAMD's Enterprise CPU and GPU roadmap: Venice, Verano, Zen 6, Helios, and CDNA
By Anton Shilov Published -
PremiumIntel's roadmaps examined — 14A, Nova Lake, Diamond Rapids & AI accelerator push
By Luke James Published -
PremiumUALink roadmap plots course to optimized AI data center interconnects
By Anton Shilov Published -
PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum future
By Francisco Pires Published -
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published
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News Analysis
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PremiumHow Nvidia's $20 billion Groq 3 LPU deal reshapes the Nvidia Vera Rubin Platform
By Luke James Published -
PremiumWith H200s set to flow into China, Groq is reportedly set to follow soon after
By Jon Martindale Published -
PremiumExamining Nvidia's 60 exaflop Vera Rubin POD — how seven chips underpin company's 40 rack AI factory supercomputer
By Luke James Published -
PremiumMeta's new MTIA lineup joins hyperscalers' unified push for dedicated inferencing chips
By Luke James Published -
PremiumTech titans team up to form optical interconnect alliance to solve the AI buildout's big data bottleneck
By Sayem Ahmed Published -
PremiumThe ongoing Strait of Hormuz blockage will impact the semiconductor and AI industries with Aluminum, Helium and LNG shortages
By Jon Martindale Published
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Latest
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PremiumMicrosoft built a ‘Community-First AI Infrastructure’ framework for its data center projects
By Jowi Morales Published -
PremiumGlass cloth could be the next great AI shortage, as major manufacturers scramble to secure critical material
By Jon Martindale Published -
PremiumAnalyzing Washington's new AI accelerator export rules
By Anton Shilov Published -
PremiumGlobalFoundries acquires ARC and RISC-V IP from Synopsys
By Anton Shilov Published -
PremiumSK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record
By Anton Shilov Published -
PremiumAI chip design is pushing advanced chip packaging to its limits
By Luke James Published -
PremiumQwen boss says Chinese AI models have 'less than 20%' chance of leapfrogging Western counterparts
By Luke James Published -
PremiumDeepseek research touts memory breakthrough, decoupling compute power and RAM pools to bypass GPU constraints
By Sayem Ahmed Published -
PremiumJensen Huang discusses the economics of inference, power delivery, and more at CES 2026 press Q&A session
By Luke James Published -
PremiumIntel Panther Lake press Q&A transcript — EVO is still alive, and the company ditches prior-generation naming scheme
By Sayem Ahmed Published -
PremiumChinese researchers hail breakthrough in DRAM-like cells, which could be used in embedded or 3D stacked memory
By Anton Shilov Published -
PremiumNvidia refutes reports of HBM4 mass production delay, production 'on track' for the second half of 2025
By Luke James Published
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