Tomshardware Premium
Deeper analysis. Exclusive features. Insider access. 3DTested Premium is the expert’s guide to tech.
-

Ultra Ethernet: The data-center interconnection of tomorrow detailed
-
-
PremiumAlphabet is doubling its capital expenditure to a staggering $180 billion in 2026
-
PremiumMemory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers
-

Access Bench to view a treasure trove of data and compare products
-

Leave your feedback on 3DTested Premium
-
Subscribe to 3DTested Premium
- ✓ Premium-exclusive features and interviews
- ✓ Unlock expert news analysis and roadmaps
- ✓ Harness the power of our Bench database
ANNUALLY
$108.00
$69.00
MONTHLY
$9.00
$7.00
Premium Features
View all-
-
PremiumUltra Ethernet: The data-center interconnection of tomorrow detailed
By Anton Shilov Published -
PremiumCPU scaling with DLSS
By Jake Roach Published -
PremiumPhotonics and high-speed data movement is the next big AI bottleneck
By Chris Stokel-Walker Published -
PremiumThe Stout Owl: How I Built the Ultimate Noctua G2 PC
By Niels Broekhuijsen Published -
PremiumAMD CES 2026 gaming trends press Q&A roundtable transcript — 'we see a little bit of an uptick in the percentage of AM4 versus AM5 platforms'
By Zak Killian Published -
PremiumAMD ROCm CES 2026 press Q&A roundtable transcript — 'ROCm from 2023 is completely unrecognizable to ROCm today' company details, as it seeks to break down barriers to AI development
By Zak Killian Published
-
Roadmaps
View All-
-
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published -
News AnalysisMicron details new U.S. Fab projects — HBM production coming to America
By Anton Shilov Published -

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov Published
-
News Analysis
View all-
-
PremiumMemory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers
By Anton Shilov Published -
PremiumAlphabet is doubling its capital expenditure to a staggering $180 billion in 2026
By Jon Martindale Published -
PremiumClaimed 1,100% increase in AI-driven layoffs in 2025 might be misleading
By Jon Martindale Published -
PremiumAmazon’s European data center projects stalled by grid delays spanning up to seven years
By Luke James Published -
PremiumTSMC is on track to have more employees than Intel for the first time in history
By Anton Shilov Published -
PremiumTesla's robotics ambitions rest on the knife-edge of US-China trade relations due to its supply chain
By Jon Martindale Published
-
Latest
-
-
PremiumKioxia's next-gen 3D NAND production gets expedited to 2026, report claims
By Anton Shilov Published -
PremiumNew 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes
By Luke James Published -

Qualcomm’s Ventana acquisition points to a long-term RISC-V strategy to complement its Arm lineup
By Luke James Published -
PremiumThe data center cooling state of play (2025) — Liquid cooling is on the rise as thermal density demands skyrocket in AI data centers
By Anton Shilov Published -
PremiumAmazon unveils 192-core Graviton5 CPU with massive 180 MB L3 cache in tow
By Anton Shilov Published -
PremiumCambricon targets 500,000 AI chips in 2026 as China accelerates domestic hardware push
By Luke James Published -
PremiumMicrosoft, Google, OpenAI, and Anthropic join forces to form Agentic AI alliance, according to report
By Jon Martindale Published -
PremiumThe Nvidia H200 export saga, as it happened — Beijing ponders response and buyers line up
By Luke James Published -
PremiumMarvell’s $5.5B Celestial AI acquisition expands its role in AI data center hardware
By Luke James Published -
PremiumThe Senate's new SAFE bill is set to curb access to advanced chips to China, but that won't slow down the AI war
By Jon Martindale Published -
PremiumSplave's Cave: Overclocking the Asus RTX 5090 Astral and setting the 3DMark Port Royal world record
By Allen 'Splave' Golibersuch Published -
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published
-