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Ultra Ethernet: The data-center interconnection of tomorrow detailed
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PremiumAlphabet is doubling its capital expenditure to a staggering $180 billion in 2026
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PremiumMemory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers
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Premium Features
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PremiumUltra Ethernet: The data-center interconnection of tomorrow detailed
By Anton Shilov Published -
PremiumCPU scaling with DLSS
By Jake Roach Published -
PremiumPhotonics and high-speed data movement is the next big AI bottleneck
By Chris Stokel-Walker Published -
PremiumThe Stout Owl: How I Built the Ultimate Noctua G2 PC
By Niels Broekhuijsen Published -
PremiumAMD CES 2026 gaming trends press Q&A roundtable transcript — 'we see a little bit of an uptick in the percentage of AM4 versus AM5 platforms'
By Zak Killian Published -
PremiumAMD ROCm CES 2026 press Q&A roundtable transcript — 'ROCm from 2023 is completely unrecognizable to ROCm today' company details, as it seeks to break down barriers to AI development
By Zak Killian Published
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Roadmaps
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PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published -
News AnalysisMicron details new U.S. Fab projects — HBM production coming to America
By Anton Shilov Published -

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov Published
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News Analysis
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PremiumMemory makers are set to earn $551 billion from the AI boom, twice as much as contract chip manufacturers
By Anton Shilov Published -
PremiumAlphabet is doubling its capital expenditure to a staggering $180 billion in 2026
By Jon Martindale Published -
PremiumClaimed 1,100% increase in AI-driven layoffs in 2025 might be misleading
By Jon Martindale Published -
PremiumAmazon’s European data center projects stalled by grid delays spanning up to seven years
By Luke James Published -
PremiumTSMC is on track to have more employees than Intel for the first time in history
By Anton Shilov Published -
PremiumTesla's robotics ambitions rest on the knife-edge of US-China trade relations due to its supply chain
By Jon Martindale Published
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Latest
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PremiumAnalyzing Washington's new AI accelerator export rules
By Anton Shilov Published -
PremiumGlobalFoundries acquires ARC and RISC-V IP from Synopsys
By Anton Shilov Published -
PremiumSK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record
By Anton Shilov Published -
PremiumAI chip design is pushing advanced chip packaging to its limits
By Luke James Published -
PremiumQwen boss says Chinese AI models have 'less than 20%' chance of leapfrogging Western counterparts
By Luke James Published -
PremiumDeepseek research touts memory breakthrough, decoupling compute power and RAM pools to bypass GPU constraints
By Sayem Ahmed Published -
PremiumJensen Huang discusses the economics of inference, power delivery, and more at CES 2026 press Q&A session
By Luke James Published -
PremiumIntel Panther Lake press Q&A transcript — EVO is still alive, and the company ditches prior-generation naming scheme
By Sayem Ahmed Published -
PremiumChinese researchers hail breakthrough in DRAM-like cells, which could be used in embedded or 3D stacked memory
By Anton Shilov Published -
PremiumNvidia refutes reports of HBM4 mass production delay, production 'on track' for the second half of 2025
By Luke James Published -
PremiumMicron to begin work on $100 billion New York 'megafab' imminently
By Anton Shilov Published -
PremiumNvidia CEO Jensen Huang explains why SRAM isn't here to eat HBM's lunch
By Luke James Published
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