3D-printed fan-less and pump-less liquid cooler can deliver 600 watts of cooling for data centers — passive design provides reusable heat, exceeds project performance expectations by 50%

Danish Institute passive datacenter cooler
(Image credit: Danish Technological Institute)

Move over, Frore, there's a new player in town. A research team comprising boffins from the Danish Technological Institute and the Heatflow company have come up with a 3D-printed cooler that can draw a whopping 600 W off a chip fully passively, without any pumps or fans, 3D Printing Industry reports. The design is naturally aimed at datacenters first and foremost, though one can imagine a world where variations on the design could work on desktop PCs and workstations.

Should the presented figures pan out, to say this cooler is impressive is quite the understatement. The original specification set an already-ambitious target of 400 W, a figure that was exceeded by a nice, round 50%.

The cooler's dissipation ability is impressive enough, but the liquid that goes out of it is claimed to be at 60 to 80°C, making it easy to recover and use in other heating networks for a double-whammy. The report claims these figures are superior to standard datacenter cooling that whisks away heat at lower temperatures, making it harder to reuse.

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Bruno Ferreira
Contributor
  • Dementoss
    Admin said:
    We do hope this technology makes its way to our gaming PCs... Whenever we can afford RAM again.
    RAM is no problem, I've still got two kidneys...
    Reply
  • bit_user
    Nvidia's H100 (SXM) already surpassed 600W in 2022!

    If they intend to use it on CPUs, then it still has a potential window of relevance.
    Reply
  • thestryker
    3D printed blocks for LN2 provide the best results possible, but also cost significantly more money. I don't see how the TCO on something like this balances out as that would be the only way it really makes sense. As bit_user points out at a rack scale this design would only be sufficient for CPUs which makes it even more questionable.
    Reply
  • bit_user
    thestryker said:
    3D printed blocks for LN2 provide the best results possible, but also cost significantly more money. I don't see how the TCO on something like this balances out as that would be the only way it really makes sense. As bit_user points out at a rack scale this design would only be sufficient for CPUs which makes it even more questionable.
    Although my post was rather glib, I don't know what were the project's objectives. $1.56 million seems like quite a lot of money for a simple research project, but perhaps this is just the first phase in what's ultimately meant to be something that can be produced at commercially-relevant costs & volumes.

    I definitely support more efficient & reliable cooling. It seems to me this should fall somewhere between a water cooling system and a heat pipe, in terms of reliability.
    Reply
  • alan.campbell99
    This certainly is an interesting development and more efficiency is great, however, I must say I'm more jaded these days about high-end tech news. I used to follow, among other aspects, HPC-related news with genuine interest because it was bleeding edge stuff going into supercomputers and the like. Research and science-oriented developments. It wasn't anything I'd ever expect to touch but I thought the progress was cool.
    For now though it seems it's all about the AI datacentres, for me it leaves a bitter taste given the various related issues with these.

    Perhaps it could be adapted for the desktop.
    Reply
  • thestryker
    bit_user said:
    I definitely support more efficient & reliable cooling. It seems to me this should fall somewhere between a water cooling system and a heat pipe, in terms of reliability.
    Oh certainly, but the financials have to make sense and at the datacenter level I just don't see it. Liquid cooling cuts down enough on operational costs, despite being more expensive up front than air, to make it viable. If the block costs here are much higher and the only benefit is losing the pump then the operational cost isn't going to be dramatically different than liquid.
    Reply
  • umeng2002_2
    Well, exquisite internal layout is all of it.
    Reply
  • reghir
    Admin said:
    3D-printed passive cooler can pull 600 W off a datacenter chip

    3D-printed fan-less and pump-less liquid cooler can deliver 600 watts of cooling for data centers — passive design provides reusable heat, exceeds...: Read more
    I have to admit that looking at the 3d print I thought it looked like an amoeba mated a partial octopus:)
    Reply
  • Charles Cabbage
    Thermosiphons are extremely cool; I'm eagerly awaiting the Noctua consumer offering, even if it costs an arm and a leg.

    Https://www.tomshardware.com/pc-components/liquid-cooling/noctuas-futuristic-thermosiphon-cooler-is-back-and-bigger-than-ever-at-computex-2025-but-still-no-closer-to-release
    Reply