Nvidia's CUDA Tile examined: AI giant releases programming style for Rubin, Feynman, and beyond — tensor-native execution model lays the foundation for Blackwell and beyond By Anton Shilov published 31 December 25 Premium Tensors FTW in Rubin, Feynman, and beyond.
Russia cracks down on 'illegal' cryptomining with prison terms up to five years — Kremlin will begin prosecuting in 2027 By Anton Shilov published 30 December 25 The Russian government plans to penalize 'illegal' mining of cryptocurrency to prison terms of up to five years.
Start-up plans to use terahertz radio frequencies for communication between servers instead of copper or optical connections — radio-based interconnections offer 1.6 TB/s using half the volume of copper By Anton Shilov last updated 30 December 25 When copper is not enough and yet optical interconnections are overkill, waveguide-based cables can do the job.
China tells chipmakers to use homegrown chipmaking tools for 50% of new capacity — decree designed to squeeze foreign suppliers out of supply chain By Anton Shilov published 30 December 25 But there is a catch, or two.
TSMC begins quietly volume production of 2nm-class chips — first GAA transistor for TSMC claims up to 15% improvement at ISO power By Anton Shilov published 29 December 25 As planned.
TSMC's average wafer prices increased by over 15% each year since 2019, report suggests — gross profit margins increase by 3.3x in 2025 alone, facing no real challengers By Anton Shilov published 29 December 25 Premium TSMC hits a home run in the EUV era.
Louis Gerstner, the man who saved IBM, dies at 83 — industry mourns the passing of transformative CEO By Anton Shilov published 28 December 25 The man who envisioned services as core business for high-tech companies leaves behind a tall legacy.
Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's biggest — floorplan the size of a cellphone, armed with HBM5, 14A compute tiles and 18A SRAM By Anton Shilov published 26 December 25 Intel Foundry has released a video of a multi-chiplet 2.5D/3D processor with a 10,296 mm^2 silicon footprint, including leading-edge technologies such as 14A and 18A.
China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip — sanctions-busting experiment is still years away from becoming operational By Anton Shilov published 24 December 25 Premium Recreating an entire supply chain is incredibly difficult
Intel's Fab 52 is bigger and better equipped than TSMC's Arizona facilities — Intel's production volume dwarfs TSMC's operations in the U.S. By Anton Shilov last updated 23 December 25 Intel's Fab 52 in Arizona is currently the most advanced chip production facility in America, but it has yet to reach its full 40,000-wafer capacity due to low 18A yields.
AMD publishes first Zen 6 document detailing ground-up redesign on 2nm process node — brand-new 8-wide CPU core with strong vector capabilities By Anton Shilov published 20 December 25 AMD's Zen 6-based CPUs may be number crunching monsters, given their core design that is partially revealed in a performance counters document.
Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S. — limit exports to two generations behind leading-edge nodes, could slow down U.S. expansion By Anton Shilov published 19 December 25 Taiwan's government is considering imposing N+2 export rule on TSMC's advanced process technologies, which would make it significantly harder for the foundry to develop overseas.
Intel-certified 256 GB DDR5 stick could cut Xeon memory power by 18%, saving millions of dollars — a 32W-per-socket reduction could save millions per hyperscale data center By Anton Shilov published 19 December 25 SK hynix first to validate 32Gb-based 256GB DDR5 module with Intel: up to 32.4W power savings per server, or millions of dollars per hyperscale data center.
TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3nm months ahead of schedule — Arizona fab slated for production in 2027 By Anton Shilov published 18 December 25 Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.
China may have reverse engineered EUV lithography tool in covert lab, report claims — employees given fake IDs to avoid secret project being detected, prototypes expected in 2028 By Anton Shilov published 18 December 25 Well, kind of.
Sales of chip production equipment to reach $156 billion by 2027 — China, Taiwan, and Korea lead intense demand By Anton Shilov published 17 December 25 Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.
Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals By Anton Shilov published 17 December 25 Wedding glass and PLP ahead of others?
Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks By Anton Shilov published 17 December 25 2D materials are getting closer to manufacturability using industry-standard equipment.
Intel installs industry's first commercial High-NA EUV lithography tool — ASML Twinscan EXE:5200B sets the stage for 14A By Anton Shilov published 17 December 25 Sets the stage for 14A process technology.
Kioxia's next-gen 3D NAND production gets expedited to 2026, report claims — high-capacity 332-layer BiCS10 devices to sate growing demand from AI data centers By Anton Shilov published 17 December 25 Premium Mass production of 332-layer BiCS10 accelerated from 2027 to 2026.
The data center cooling state of play (2025) — Liquid cooling is on the rise, thermal density demands skyrocket in AI data centers, and TSMC leads with direct-to-silicon solutions By Anton Shilov published 16 December 25 Premium From the air outside to de-ionized water inside.
Amazon unveils 192-core Graviton5 CPU with massive 180 MB L3 cache in tow — ambitious server silicon challenges high-end AMD EPYC and Intel Xeon in the cloud By Anton Shilov published 15 December 25 Premium AWS's new 192-core Graviton5 processor with a massive 180 MB L3 cache marks the company's most ambitious in-house CPU yet, which could enable it to replace more AMD and Intel servers in its cloud.
Industry preps new 'cheap' HBM4 memory spec with narrow interface, but it isn't a GDDR killer — JEDEC's new SPHBM4 spec weds HBM4 performance and lower costs to enable higher capacity By Anton Shilov published 13 December 25 A GDDR killer from the HBM camp? Not quite.
Nvidia details new software that enables location tracking for AI GPUs — opt-in remote data center GPU fleet management includes power usage and thermal monitoring By Anton Shilov published 13 December 25 Including tracking of physical location.
Oracle reportedly delays several new OpenAI data centers because of shortages — tight material and labor supply frustrate expansion plans, possibly by a year or more By Anton Shilov published 12 December 25 Oracle reportedly delays some of the data centers for OpenAI from 2027 to 2028, citing labor and materials shortages.
